With the advent of the 5g Internet of things era, the demand for high-performance and high-density computing is accelerating, and the energy consumption problem of the data center is increasingly prominent.

• the trend of liquid cooling technology

As we all know, if the heat dissipation is poor, the high temperature will not only reduce the working stability of the chip, but also generate excessive thermal stress due to the temperature difference between the internal and external environment of the module, affecting the electrical performance, working frequency, mechanical strength and reliability of the chip. The failure rate of electronic components increases exponentially with the increase of working temperature. The reliability of the system will be reduced by 50% for every 10 degree increase in the temperature of a single semiconductor element.

In response to the "power consumption wall" of big data and super density computing, the use of liquid coolant instead of air to cool computer equipment is a technological revolution in the future data center.

According to the data, by 2023, the global liquid cooling data center market will reach US $4.55 billion, with an annual compound growth rate of 27.7%.

Compared with traditional air cooling technology, liquid cooling technology has the following obvious advantages:

-More heat taken away: the heat taken away by the same volume of liquid is nearly 3000 times that of the same volume of air.

-Faster temperature transfer: the thermal conductivity of liquid is 25 times that of air.

-Better noise quality: at the same heat dissipation level, the noise level of liquid cooling is 20-35 dB lower than that of air cooling.

-Power consumption and energy saving: the liquid cooling system saves about 30% - 50% of power than the air cooling system.